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Patterning of SiO2 nanoparticle–PMMA polymer composite microstructures based on soft lithographic techniques

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dc.contributor.author Singh, Akanksha en_US
dc.contributor.author KULKARNI, SULABHA en_US
dc.contributor.author Khan-Malek, Chantal en_US
dc.date.accessioned 2019-02-14T05:49:50Z
dc.date.available 2019-02-14T05:49:50Z
dc.date.issued 2011-06 en_US
dc.identifier.citation Microelectronic Engineering, 88(6), 939-944 en_US
dc.identifier.issn 0167-9317 en_US
dc.identifier.issn 1873-5568 en_US
dc.identifier.uri http://dr.iiserpune.ac.in:8080/xmlui/handle/123456789/1779
dc.identifier.uri https://doi.org/10.1016/j.mee.2010.12.026 en_US
dc.description.abstract Soft lithography and self-assembly provide powerful means of organizing colloidal solution of synthesized nanoparticles (NPs) for a wide variety of application. Pattern transfer of silicon dioxide (SiO2) nanoparticles–polymethylmethacylate (PMMA) nanocomposite was investigated using two such soft lithographic techniques, micro molding in capillaries (MIMIC) and micro transfer molding (μTM) using an elastomeric stamp in Polydimethyl siloxane (PDMS). Nanocomposite periodic arrays of 20 μm wide and 10 μm deep lines with 10 μm spacing were obtained over approximately 1 cm2 area on silicon substrates by μTM and MIMIC using a 3 wt.% monodisperse silica nanoparticles (∼338 ± 2 nm) in polymethyl methacrylate (PMMA) solution. In addition, free standing nanocomposite self-standing films of centimeter size were also manufactured by μTM. Single line of nanocomposite could also be obtained using MIMIC with a lower concentration of silica NPs (0.25 wt.%) in PMMA. en_US
dc.language.iso en en_US
dc.publisher Elsevier B.V. en_US
dc.subject Nanoparticles en_US
dc.subject PDMS en_US
dc.subject MIMIC en_US
dc.subject μTM en_US
dc.subject PMMA en_US
dc.subject Soft lithography en_US
dc.subject 2011 en_US
dc.title Patterning of SiO2 nanoparticle–PMMA polymer composite microstructures based on soft lithographic techniques en_US
dc.type Article en_US
dc.contributor.department Dept. of Physics en_US
dc.identifier.sourcetitle Microelectronic Engineering en_US
dc.publication.originofpublisher Foreign en_US


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